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Pb-FREE SOLDER PAST TLF-SERIES
LFSOLDER TLF-209-111M
1. Features
1) Pb-free (Sn/Ag/Cu series) solder alloy.
2) Stable printability with little change in viscosity during continuous printing.
3) Reduces void formatin.
4) Reduces mid-chip solder balls.
5) Does not slump in pre-heat.
6) Excellent solderability at high temperature.
7) Excellent solderability on fine pitch patterns of 0.5mm pitch CSP.
